Multi-Chip and Bare Chip Packaging Technologies. The Requirement for Bare Chip Quality.
نویسندگان
چکیده
منابع مشابه
Chip-to-chip interconnect integration technologies
With continuous increase in the off-chip bandwidth requirements, conventional interconnection methodologies are quickly becoming incapable of meeting the demand. Recent progress in silicon interposer and 3D integration technologies seek to alleviate some of these bottlenecks. This paper reviews the evolution of conventional interconnect methodologies and recent progress in platforms allowing hi...
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ژورنال
عنوان ژورنال: The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits
سال: 1997
ISSN: 1884-1201,1341-0571
DOI: 10.5104/jiep1995.12.482